[Packaging Example] Cushioning Material for Semiconductor Devices
Efficient collective packaging! We meet the stringent needs of the electronic components field.
We would like to introduce an example of "buffer materials for semiconductor devices" that we handle. We use Santech Foam "Grade A," which has high static electricity prevention performance. It reduces dust adhesion and prevents electrostatic destruction of devices. We also introduce examples of "packaging boxes for hard disks" and "shipping boxes for optical components." 【Example Overview】 <Features of Buffer Materials for Semiconductor Devices> ■ Reduces dust adhesion and prevents electrostatic destruction of devices. *For more details, please refer to the related links or feel free to contact us.
- Company:生出
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